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Power chips are connected to exterior circuits through packaging, and their efficiency relies on the support of the packaging. In high-power scenarios, power chips are normally packaged as power modules. Chip affiliation describes the electric connection on the top surface area of the chip, which is usually aluminum bonding wire in typical components. ^ Conventional power module plan cross-section
Presently, business silicon carbide power components still mostly utilize the packaging innovation of this wire-bonded standard silicon IGBT component. They deal with troubles such as large high-frequency parasitic parameters, inadequate warmth dissipation ability, low-temperature resistance, and insufficient insulation strength, which restrict making use of silicon carbide semiconductors. The display screen of excellent efficiency. In order to fix these problems and fully exploit the big possible advantages of silicon carbide chips, several new packaging modern technologies and options for silicon carbide power components have actually emerged in recent times.
Silicon carbide power module bonding technique
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding products have created from gold cord bonding in 2001 to aluminum cord (tape) bonding in 2006, copper wire bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have created from gold cords to copper cords, and the driving pressure is cost reduction; high-power devices have actually established from aluminum wires (strips) to Cu Clips, and the driving pressure is to enhance item performance. The greater the power, the greater the needs.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging procedure that uses a strong copper bridge soldered to solder to connect chips and pins. Compared with conventional bonding product packaging techniques, Cu Clip innovation has the following advantages:
1. The connection between the chip and the pins is made of copper sheets, which, to a certain degree, replaces the common cable bonding approach between the chip and the pins. As a result, a distinct plan resistance value, higher current circulation, and much better thermal conductivity can be gotten.
2. The lead pin welding location does not require to be silver-plated, which can totally conserve the cost of silver plating and bad silver plating.
3. The product look is entirely constant with typical items and is generally used in servers, portable computers, batteries/drives, graphics cards, electric motors, power supplies, and other areas.
Cu Clip has two bonding approaches.
All copper sheet bonding method
Both eviction pad and the Resource pad are clip-based. This bonding approach is more expensive and complex, but it can accomplish far better Rdson and much better thermal results.
( copper strip)
Copper sheet plus cord bonding technique
The resource pad uses a Clip method, and eviction uses a Wire approach. This bonding method is somewhat more affordable than the all-copper bonding approach, saving wafer area (applicable to very tiny gate locations). The procedure is simpler than the all-copper bonding method and can acquire far better Rdson and far better thermal effect.
Provider of Copper Strip
TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper, please feel free to contact us and send an inquiry.
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