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Power chips are attached to external circuits through product packaging, and their efficiency depends on the assistance of the packaging. In high-power situations, power chips are typically packaged as power components. Chip affiliation refers to the electric link on the upper surface area of the chip, which is normally aluminum bonding cable in conventional modules. ^ Conventional power component bundle cross-section
Currently, industrial silicon carbide power components still mostly use the packaging innovation of this wire-bonded conventional silicon IGBT component. They encounter problems such as big high-frequency parasitic criteria, not enough warm dissipation capacity, low-temperature resistance, and not enough insulation toughness, which restrict using silicon carbide semiconductors. The screen of exceptional performance. In order to resolve these issues and completely exploit the big possible advantages of silicon carbide chips, numerous new product packaging modern technologies and services for silicon carbide power modules have emerged in recent times.
Silicon carbide power component bonding method
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding products have developed from gold wire bonding in 2001 to aluminum wire (tape) bonding in 2006, copper wire bonding in 2011, and Cu Clip bonding in 2016. Low-power devices have actually created from gold cords to copper cables, and the driving force is expense decrease; high-power tools have established from aluminum cables (strips) to Cu Clips, and the driving pressure is to enhance product performance. The better the power, the higher the requirements.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging procedure that utilizes a strong copper bridge soldered to solder to link chips and pins. Compared with typical bonding packaging techniques, Cu Clip modern technology has the adhering to benefits:
1. The link between the chip and the pins is constructed from copper sheets, which, to a particular level, replaces the standard cable bonding approach between the chip and the pins. For that reason, a distinct bundle resistance value, higher present circulation, and much better thermal conductivity can be obtained.
2. The lead pin welding location does not require to be silver-plated, which can totally conserve the expense of silver plating and poor silver plating.
3. The product look is completely regular with typical items and is mainly used in web servers, mobile computer systems, batteries/drives, graphics cards, electric motors, power supplies, and various other areas.
Cu Clip has two bonding techniques.
All copper sheet bonding method
Both eviction pad and the Resource pad are clip-based. This bonding method is a lot more expensive and complicated, but it can attain much better Rdson and better thermal impacts.
( copper strip)
Copper sheet plus cord bonding approach
The source pad uses a Clip technique, and eviction utilizes a Cord technique. This bonding method is a little less expensive than the all-copper bonding approach, conserving wafer location (appropriate to really tiny gate locations). The procedure is simpler than the all-copper bonding technique and can get far better Rdson and far better thermal result.
Distributor of Copper Strip
TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper, please feel free to contact us and send an inquiry.
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