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The most important requirements for electronics packaging substrates are high electrical resistivity, low thermal conductivity, as well as low dielectric constant. Also, the packaging substrate needs to be thermally compatible with silicon wafers. It should have easy molding, high flatness, easy metalization, low cost and other properties. The most popular substrate material is ceramics due to its excellent insulation properties, stability chemical properties, high thermal conductivity and high high frequency characteristics. Commonly used ceramic substrate materials include beryllium oxide, aluminum oxide, aluminum nitride, etc. Aluminum oxide ceramic substrate has low thermal conductivity and a lower thermal expansion coefficient than silicon. However, beryllium oxide is renowned for its excellent properties. The most suitable substrate material is aluminum nitride ceramics, which have high thermal conductivity, excellent thermal shock resistance and good mechanical properties even at very high temperatures.
Transparent ceramic material
The transparent nature of ceramics is generally defined as the ability to transmit electromagnetic waves in a specific frequency band. Infrared transparent ceramics are, for example, ceramic sheets that can be penetrated by electromagnetic waves within the infrared frequency range. Pure aluminum nitride clays, which are transparent and colorless crystals that have excellent optical properties, can be used for heat-resistant coatings of high-temperature Infrared Windows and fairings in the fabrication of electronic optical devices. Therefore, aluminum nitride Ceramics can be used in military industries.
Use of aluminum nitride for machinery manufacturing
Aluminum nitride can be used for wear-resistant components due to its excellent resistance against wear. Due to its high price, aluminum nitride cannot be used for parts with severe wear. An aluminum nitride coat can protect metal surfaces and other non-metals from oxidation. As an anti-corrosion treatment, aluminum nitride may also be used to line containers or processors with corrosive chemicals.
Aluminum nitride high-temperature structure material
The aluminum nitride is stable at both high and low temperatures and has good resistance to corrosion. It can be decomposed at 2450°C. It is suitable for high-temperature materials such as crucibles, casting molds, and other high-temperature refractory substances. It is not compatible with aluminum nitride clays, which can be wetted with aluminum, copper, silver, or any other substance. They are also insensitive to aluminum, iron and their alloys. You can use it as a container or high-temperature protective layer, like thermocouple protection tube and sintering appliance. For high-end semiconductor equipment like the aluminum nitride clay electrostatic chuck, corrosive gas can be used. Because aluminum nitride has a high stability to molten metal salts like gallium Arsenide, you can use aluminum nitride ceramic crucibles to produce gallium-arsenide semiconductors.
Aluminum Nitride Composite
A composite epoxy/aluminum nutride material. Packaging material must have good heat and thermal dissipation capabilities. The epoxy resin is a high-quality polymer with excellent chemical properties and mechanical stability. However, it has low thermal conductivity. You can increase the strength and thermal conductivity of epoxy resin by adding Nano aluminium nitride powder. This has excellent thermal conductivity.
The N/AlN composite materials: Titanium-nitride is a high melting point and hardness material. Additionally, it has the same electrical and thermal conductivity as metal. To the mixture is added a little bit of titanium nitride. aluminum nitride matrix. According to the theory conductive percolation, once the doping level reaches a specified threshold, a conductor path forms in the crystal. It can adjust the volume resistivity to aluminum nitride-sintered body by up to 24 orders of magnitude. Composite ceramic materials, which are made of the two substances, have high wear and hardness. They can be also used to make high-grade abrasive products.
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